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? 2006-2014 microchip technology inc. ds20001422g-page 1 tc4426/tc4427/tc4428 features: high peak output current: 1.5a wide input supply voltage operating range: - 4.5v to 18v high capacitive load drive capability: 1000 pf in 25 ns (typical) short delay times: 40 ns (typical) matched rise and fall times low supply current: - with logic 1 input C 4 ma - with logic 0 input C 400 a low output impedance: 7 ? latch-up protected: withstands 0.5a reverse current input withstands negative inputs up to 5v electrostatic discharge (esd) protected: 2.0 kv space-saving 8-pin msop and 8-pin 6x5 dfn-s packages applications: switch mode power supplies line drivers pulse transformer drive general description: the tc4426/tc4427/tc4428 are improved versions of the earlier tc426/tc427/tc428 family of mosfet drivers. the tc4426/tc4427/tc4428 devices have matched rise and fall times when charging and discharging the gate of a mosfet. these devices are highly latch-up resistant under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spiking (of either polarity) occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of reverse current (of either polarity) being forced back into their outputs. all terminals are fully protected against electrostatic discharge (esd) up to 2.0 kv. the tc4426/tc4427/tc4428 mosfet drivers can easily charge/discharge 1000 pf gate capacitances in under 30 ns. these devices provide low enough impedances in both the on and off states to ensure the mosfets intended state is not affected, even by large transients. other compatible drivers are the tc4426a/tc4427a/ tc4428a family of devices. the tc4426a/tc4427a/ tc4428a devices have matched leading and falling edge input-to-output delay times, in addition to the matched rise and fall times of the tc4426/tc4427/ tc4428 devices. package types 12 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4426 tc4427 tc4426 tc4427 ncout a out b v dd tc4428 ncout a out b v dd tc4428 ncout a out b v dd tc4426 tc4427 ncout a out b v dd tc4428 ncout a out b v dd 8-pin msop/ pdip/soic gnd in ain b 1 2 3 4 8 7 6 5 nc ep 9 8-pin dfn-s* * includes exposed thermal pad (ep); see table 3-1 . 1.5a dual high-speed power mosfet drivers downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 2 ? 2006-2014 microchip technology inc. functional block diagram effective input c = 12 pf (each input) tc4426/tc4427/tc4428 output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: tc4426 has two inverting drivers, while the tc4427 has two non-inverting drivers. the tc4428 has one inverting and one non-inverting driver. 2: ground any unused driver input. 1.5 ma downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 3 tc4426/tc4427/tc4428 1.0 electrical characteristics absolute maximum ratings ? supply voltage ............................................... .................+22v input voltage, in a or in b .......... (v dd + 0.3v) to (gnd C 5v) package power dissipation (t a ?? +70c) dfn-s ..................................................................... note 3 msop.....................................................................340 mw pdip .......................................................................730 mw soic.......................................................................470 mw storage temperature range .........................-65c to +150c maximum junction temperature ................................. +150c ? stresses above those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the spec ifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, t a = +25oc with 4.5v ? v dd ? 18v. parameters sym. min. typ. max. units conditions input logic 1 , high input voltage v ih 2.4 v note 2 logic 0 , low input voltage v il 0 . 8v input current i in -1.0 +1.0 a 0v ??? v in ??? v dd output high output voltage v oh v dd C 0.025 v dc test low output voltage v ol 0.025 v dc test output resistance r o 71 0 ? i out = 10 ma, v dd = 18v peak output current i pk 1 . 5a v dd = 18v latch-up protection withstand reverse current i rev > 0.5 a duty cycle ???? 2%, t ??? 300 s v dd = 18v switching time ( note 1 ) rise time t r 1 93 0n s figure 4-1 fall time t f 1 93 0n s figure 4-1 delay time t d1 2 03 0n s figure 4-1 delay time t d2 4 05 0n s figure 4-1 power supply power supply current i s 4.5 0.4 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v. 3: package power dissipation is dependent on the copper pad area on the pcb. downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 4 ? 2006-2014 microchip technology inc. dc characteristics (over operating temperature range) temperature characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v ? v dd ? 18v. parameters sym. min. typ. max. units conditions input logic 1 , high input voltage v ih 2.4 v note 2 logic 0 , low input voltage v il 0 . 8v input current i in -10 +10 a 0v ??? v in ??? v dd output high output voltage v oh v dd C 0.025 v dc test low output voltage v ol 0 . 0 2 5 v d c t e s t output resistance r o 91 2 ? i out = 10 ma, v dd = 18v peak output current i pk 1 . 5a v dd = 18v latch-up protection withstand reverse current i rev >0.5 a duty cycle ???? 2%, t ??? 300 s v dd = 18v switching time ( note 1 ) rise time t r 4 0n s figure 4-1 fall time t f 4 0n s figure 4-1 delay time t d1 4 0n s figure 4-1 delay time t d2 6 0n s figure 4-1 power supply power supply current i s 8.0 0.6 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: for v temperature range devices, the v ih (min) limit is 2.0v. electrical specifications: unless otherwise noted, all parameters apply with 4.5v ? v dd ? 18v. parameters sym. min. typ. max. units conditions temperature ranges specified temperature range (c) t a 0+ 7 0 c specified temperature range (e) t a -40 +85 c specified temperature range (v) t a -40 +125 c maximum junction temperature t j +150 c storage temperature range t a -65 +150 c package thermal resistances thermal resistance, 8l-6x5 dfn-s ? ja 3 3 . 2 c / w thermal resistance, 8l-msop ? ja 2 0 6 c / w thermal resistance, 8l-pdip ? ja 1 2 5 c / w thermal resistance, 8l-soic ? ja 1 5 5 c / w downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 5 tc4426/tc4427/tc4428 2.0 typical performance curves note: unless otherwise indicated, t a = +25oc with 4.5v ? v dd ? 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay time vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. t rise (nsec) 4681 01 2 14 16 18 100 pf 470 pf 2200 pf 1500 pf 100 1000 pf 8060 40 20 0 v dd (v) 100 1000 10,000 c (pf) load 5v 10v 15v 100 8060 40 20 0 t rise (nsec) time (nsec) t rise temperature (?c) c = 1000 pf load v = 17.5v dd 60 ?5 35 5 25 45 65 85 105 125 ?5 t fall 5040 30 20 10 t fall (nsec) 4681 01 2 14 16 18 100 pf 470 pf 1000 pf 2200 pf 1500 pf 100 8060 40 20 0 v dd (v) 100 1000 10,000 5v 10v c (pf) load 100 8060 40 20 0 t fall (nsec) 15v 20 25 30 35 40 45 50 55 60 65 70 75 80 4 6 8 10 12 14 16 18 v dd (v) propagation delay (nsec) t d1 t d2 c load = 1000 pf v in = 5v downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 6 ? 2006-2014 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v ? v dd ? 18v. figure 2-7: propagation delay time vs. input amplitude. figure 2-8: supply current vs. supply voltage. figure 2-9: output resistance (r oh ) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: supply current vs. temperature. figure 2-12: output resistance (r ol ) vs. supply voltage. 10 15 20 25 30 35 40 45 50 55 60 0123456789101112 input amplitude (v) propagation delay (nsec) t d1 t d2 c load = 1000 pf v dd = 12v 4 i (ma) quiescent 18 6 8 10 12 14 16 0.1 both inputs = 1 both inputs = 0 v dd 1 4681 01 2 14 16 18 v dd r ds(on) ( ) 20 2515 10 5 worst case @ t j = +150?c typical @ t a = +25?c 10 15 20 25 30 35 40 45 -55 -35 -15 5 25 45 65 85 105 125 temperature (oc) delay time (nsec) t d1 t d2 c load = 1000 pf v in = 5v v dd = 18v t a (?c) i quiescent (ma) 4.03.5 3.0 2.5 2.0 ?5 35 ?5 5 25 45 65 85 105 125 v = 18v dd both inputs = 1 4681 01 2 14 16 1 8 20 v dd 2515 10 5 worst case @ t j = +150?c typical @ t a = +25?c r ds(on) ( ) downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 7 tc4426/tc4427/tc4428 note: unless otherwise indicated, t a = +25oc with 4.5v ? v dd ? 18v. figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 60 100 1000 10,000 i supply (ma) 2 mhz 600 khz 200 khz 20 khz 900 khz c (pf) load v = 18v dd 5040 30 20 10 0 100 1000 10,000 2 mhz 600 khz 200 khz 20 khz 900 khz v = 12v dd c (pf) load 6050 40 30 20 10 0 i supply (ma) 100 1000 10,000 2 mhz 200 khz 20 khz 600 khz 900 khz v = 6v dd c (pf) load 6050 40 30 20 10 0 i supply (ma) 10 100 1000 frequency (khz) 1000 pf 2200 pf v = 18v dd 100 pf 6050 40 30 20 10 0 i supply (ma) 10 100 1000 frequency (khz) 1000 pf 2200 pf 100 pf v = 12v dd 6050 40 30 20 10 0 i supply (ma) 10 100 1000 frequency (khz) 1000 pf 2200 pf 100 pf v = 6v dd 6050 40 30 20 10 0 i supply (ma) downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 8 ? 2006-2014 microchip technology inc. note: unless otherwise indicated, t a = +25oc with 4.5v ? v dd ? 18v. figure 2-19: crossover energy vs. supply voltage. 4 a ?sec 18 6 8 10 12 14 16 87 6 5 4 3 2 10 ? 10 ? 9 v dd note: the values on this graph represent the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4. downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 9 tc4426/tc4427/tc4428 3.0 pin descriptions the descriptions of the pins are listed in tab l e 3 - 1 . table 3-1: pin function table ( 1 ) 3.1 inputs a and b mosfet driver inputs a and b are high-impedance, ttl/cmos compatible inputs. these inputs also have 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.2 ground (gnd) ground is the device return pin. the ground pin(s) should have a low-impedance connection to the bias supply source return. high peak current flows out the ground pin(s) when the capacitive load is being discharged. 3.3 output a and b mosfet driver outputs a and b are low-impedance, cmos push-pull style outputs. the pull-down and pull- up devices are of equal strength, making the rise and fall times equivalent. 3.4 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 18v with respect to the ground pin. the v dd input should be bypassed with local ceramic capacitors. the value of these capacitors should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.5 exposed metal pad the exposed metal pad of the 6x5 dfn-s package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board (pcb), to aid in heat removal from the package. 8-pin pdip/ msop/soic 8-pin dfn-s symbol description 1 1 nc no connection 2 2 in a input a 33g n d g r o u n d 4 4 in b input b 55o u t b o u t p u t b 66v dd supply input 77o u t a o u t p u t a 8 8 nc no connection pad nc exposed metal pad note 1: duplicate pins must be connected for proper operation. downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 10 ? 2006-2014 microchip technology inc. 4.0 applications information figure 4-1: switching time test circuit. c l = 1000 pf 0.1 f 4.7 f inverting driver non-inverting driver input v dd = 18v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall ? 10 ns output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 3 2 7 6 4 5 downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 11 tc4426/tc4427/tc4428 5.0 packaging information 5.1 package marking information pin 1 nnn pin 1 nnn legend: xx...x customer specific information* y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard device marking consists of microchip part number, year code, week co de and traceability code. tc4426 emf^^ 1315 256 4426c 315256 xxxxxxxxxxxxxnnn yyww tc4427 cpa^^nnn 1315 tc4428c oa^^yyww 256 8-lead dfn-s (6x5x0.9 mm) 8-lead msop (3x3 mm) 8-lead pdip (300 mil) 8-lead soic (150 mil) example example example example downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 12 ? 2006-2014 microchip technology inc. note 2 a1 a a3 note 1 12 e n d exposed pad note 1 2 1 e2 l n e b k bottom view top view d2 downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 13 tc4426/tc4427/tc4428 downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 14 ? 2006-2014 microchip technology inc. 1rwh for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 8$ downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 15 tc4426/tc4427/tc4428 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging ua downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 16 ? 2006-2014 microchip technology inc. 8-lead plastic micro small otline package (ua) [msop] note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 17 tc4426/tc4427/tc4428 b a for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 1rwh microchip technology drawing no. c04-018d sheet 1 of 2 /hdg3odvwlf'xdo,q/lqh 3$plo%rg\>3',3@ eb e a a1 a2 l 8x b 8x b1 d e1 c c 3/$1( .010 c 12 n note 1 top view end view side view e downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 18 ? 2006-2014 microchip technology inc. microchip technology drawing no. c04-018d sheet 2 of 2 for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 1rwh /hdg3odvwlf'xdo,q/lqh 3$plo%rg\>3',3@ units inches dimension limits min nom max number of pins n 8 pitch e .100 bsc top to seating plane a - - .210 molded package thickness a2 .115 .130 .195 base to seating plane a1 .015 shoulder to shoulder width e .290 .310 .325 molded package width e1 .240 .250 .280 overall length d .348 .365 .400 tip to seating plane l .115 .130 .150 lead thickness c .008 .010 .015 upper lead width b1 .040 .060 .070 lower lead width b .014 .018 .022 overall row spacing eb - - .430 bsc: basic dimension. theoretically exact value shown without tolerances. 3. 1. protrusions shall not exceed .010" per side. 2.4. noes: -- dimensions d and e1 do not include mold flash or protrusions. mold flash or pin 1 visual index feature may vary, but must be located within the hatched area. significant characteristic dimensioning and tolerancing per asme y14.5m e datum a datum a e b e 2 b e 2 alternate lead design (vendor dependent) downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 19 tc4426/tc4427/tc4428 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 20 ? 2006-2014 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 21 tc4426/tc4427/tc4428 downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 22 ? 2006-2014 microchip technology inc. notes: downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 23 tc4426/tc4427/tc4428 appendix a: revision history revision g (july 2014) the following is the list of modifications: 1. updated the functional block diagram . revision f (september 2013) the following is the list of modifications: 2. updated the electrostatic discharge (esd) rating to 2kv in the features section. 3. updated the package drawings in section 5.0 ?packaging information? . 4. minor typographical and editorial corrections. revisions e (december 2012) added a note to each package outline drawing. downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 24 ? 2006-2014 microchip technology inc. notes: downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 25 tc4426/tc4427/tc4428 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: tc4426: 1.5a dual mosfet driver, inverting tc4427: 1.5a dual mosfet driver, non-inverting tc4428: 1.5a dual mosfet driver, complementary temperature range: c = 0c to +70c (pdip and soic only) e = -40c to +85c v = -40c to +125c package: mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) pa = plastic dip (300 mil body), 8-lead ua = plastic micro small outline (msop), 8-lead ua713 = plastic micro small outline (msop), 8-lead (tape and reel) examples: a) tc4426coa: 1.5a dual inverting mosfet driver, 0c to +70c soic package. b) tc4426eua: 1.5a dual inverting mosfet driver, -40c to +85c. msop package. c) tc4426emf: 1.5a dual inverting mosfet driver, -40c to +85c, dfn-s package. a) tc4427cpa: 1.5a dual non-inverting mosfet driver, 0c to +70c pdip package. b) tc4427epa: 1.5a dual non-inverting mosfet driver, -40c to +85c pdip package. a) tc4428 coa713:1.5a dual complementary mosfet driver, 0c to +70c, soic package, tape and reel. b) tc4428emf: 1.5a dual complementary, mosfet driver, -40c to +85c dfn-s package. part no. x xx package temperature range device xxx tape & reel x pb free downloaded from: http:///
tc4426/tc4427/tc4428 ds20001422g-page 26 ? 2006-2014 microchip technology inc. notes: downloaded from: http:///
? 2006-2014 microchip technology inc. ds20001422g-page 27 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, flexpwr, jukeblox, k ee l oq , k ee l oq logo, kleer, lancheck, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic 32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. the embedded control solutions company and mtouch are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, ecan, in-circuit serial programming, icsp, inter-chip connectivity, kleernet, kleernet logo, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, righttouch logo, real ice, sqi, serial quad i/o, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademar ks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2006-2014, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn:978-1-63276-371-6 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
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